Kopen APTGT300H60G met BYCHPS
Koop met garantie
APTGT300H60G
- Onderdeel nummer:
- APTGT300H60G
- Fabrikant:
- Microsemi
- Beschrijving:
- IGBT MOD TRENCH FULL BRIDGE SP6
- Leid Free Status / RoHS Status:
- Loodvrij / RoHS-conform
- beschikbare kwaliteit:
- 16685 Pieces
- Data papier:
- 1.APTGT300H60G.pdf2.APTGT300H60G.pdf
Invoering
BYCHIPS is de voorraadverdeler voor APTGT300H60G, we hebben de voorraden voor directe verzending en ook beschikbaar voor langdurige levering. Stuur ons uw aankoopplan voor APTGT300H60G per e-mail, we geven u een beste prijs volgens uw plan.
bestek
| Spanning - Collector Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 1.8V @ 15V, 300A |
| Leverancier Device Pakket: | SP6 |
| Serie: | - |
| Vermogen - Max: | 1150W |
| Verpakking / doos: | SP6 |
| Temperatuur: | -40°C ~ 175°C (TJ) |
| NTC Thermistor: | No |
| montage Type: | Chassis Mount |
| Vochtgevoeligheidsniveau (MSL): | 1 (Unlimited) |
| Fabrikant Standaard Levertijd: | 22 Weeks |
| Fabrikant Onderdeelnummer: | APTGT300H60G |
| Input capaciteit (Cies) @ Vce: | 24nF @ 25V |
| Invoer: | Standard |
| IGBT Type: | Trench Field Stop |
| Uitgebreide beschrijving: | IGBT Module Trench Field Stop Full Bridge Inverter 600V 430A 1150W Chassis Mount SP6 |
| Beschrijving: | IGBT MOD TRENCH FULL BRIDGE SP6 |
| Current - Collector Cutoff (Max): | 350µA |
| Current - Collector (Ic) (Max): | 430A |
| Configuratie: | Full Bridge Inverter |
| Email: | [email protected] |
Verwante onderdelen voor APTGT300H60G
Latest Nieuws
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog