Kopen ESD3V3S1B02LRHE6327XTSA1 met BYCHPS
Koop met garantie
ESD3V3S1B02LRHE6327XTSA1
- Onderdeel nummer:
- ESD3V3S1B02LRHE6327XTSA1
- Beschrijving:
- TVS DIODE 3.3VWM 6.8VC TSLP2-17
- Leid Free Status / RoHS Status:
- Loodvrij / RoHS-conform
- beschikbare kwaliteit:
- 12822 Pieces
- Data papier:
- ESD3V3S1B02LRHE6327XTSA1.pdf
Invoering
BYCHIPS is de voorraadverdeler voor ESD3V3S1B02LRHE6327XTSA1, we hebben de voorraden voor directe verzending en ook beschikbaar voor langdurige levering. Stuur ons uw aankoopplan voor ESD3V3S1B02LRHE6327XTSA1 per e-mail, we geven u een beste prijs volgens uw plan.
bestek
| Spanning - Reverse Standoff (type): | 3.3V (Max) |
|---|---|
| Spanning - Spanning (Max) @ Ipp: | 6.8V (Typ) |
| Spanning - Onderbreking (Min): | - |
| Type: | Zener |
| Leverancier Device Pakket: | TSLP-2-17 |
| Serie: | - |
| Power Line Protection: | No |
| Power - Peak Pulse: | - |
| Packaging: | Tape & Reel (TR) |
| Verpakking / doos: | SOD-882 |
| Andere namen: | ESD3V3S1B-02LRH E6327 ESD3V3S1B-02LRH E6327TR ESD3V3S1B-02LRH E6327TR-ND ESD3V3S1B02LRHE6327 SP000908072 |
| Temperatuur: | -40°C ~ 125°C (TJ) |
| montage Type: | Surface Mount |
| Vochtgevoeligheidsniveau (MSL): | 1 (Unlimited) |
| Fabrikant Onderdeelnummer: | ESD3V3S1B02LRHE6327XTSA1 |
| Beschrijving: | TVS DIODE 3.3VWM 6.8VC TSLP2-17 |
| Current - Peak Pulse (10 / 1000μs): | 8A (8/20µs) |
| Capacitieve @ Frequentie: | 14pF @ 1MHz |
| Bidirectionele kanalen: | 1 |
| toepassingen: | General Purpose |
| Email: | [email protected] |
Verwante onderdelen voor ESD3V3S1B02LRHE6327XTSA1
Latest Nieuws
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog