Kopen RM707060 met BYCHPS
Koop met garantie
RM707060
- Onderdeel nummer:
- RM707060
- Beschrijving:
- RELAY GEN PURPOSE 3PDT 16A 60V
- Leid Free Status / RoHS Status:
- Bevat lood / RoHS-conformiteit
- beschikbare kwaliteit:
- 12663 Pieces
- Data papier:
- RM707060.pdf
Invoering
BYCHIPS is de voorraadverdeler voor RM707060, we hebben de voorraden voor directe verzending en ook beschikbaar voor langdurige levering. Stuur ons uw aankoopplan voor RM707060 per e-mail, we geven u een beste prijs volgens uw plan.
bestek
| Turn On Spanning (Max): | 45 VDC |
|---|---|
| Turn Off Voltage (Min): | 6 VDC |
| Klemtype: | PC Pin |
| switching Voltage: | 440VAC - Max |
| Serie: | RM, SCHRACK |
| release Time: | 10ms |
| Relaistype: | General Purpose |
| Packaging: | Tray |
| Andere namen: | 1-1393149-9 |
| Temperatuur: | -45°C ~ 60°C |
| opereren Time: | 15ms |
| montage Type: | Through Hole |
| Vochtgevoeligheidsniveau (MSL): | 1 (Unlimited) |
| Fabrikant Standaard Levertijd: | 29 Weeks |
| Fabrikant Onderdeelnummer: | RM707060 |
| Kenmerken: | Mechanical Indicator |
| Uitgebreide beschrijving: | General Purpose Relay 3PDT (3 Form C) 60VDC Coil Through Hole |
| Beschrijving: | RELAY GEN PURPOSE 3PDT 16A 60V |
| Contact Rating (Current): | 16A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contactformulier: | 3PDT (3 Form C) |
| coil Voltage: | 60VDC |
| coil Type: | Non Latching |
| coil Resistance: | 2.2 kOhms |
| coil Vermogen: | 1.6 W |
| coil Current: | 26.7mA |
| Email: | [email protected] |
Verwante onderdelen voor RM707060
Latest Nieuws
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog